Jun Gao

Title: Innovations by Jun Gao in Semiconductor Technology

Introduction

Jun Gao is a notable inventor based in Guangdong, China. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patents. With a total of two patents to his name, Gao continues to push the boundaries of what is possible in his industry.

Latest Patents

Gao's latest patents include a "Temporary carrier and method for manufacturing coreless substrate." This invention features a temporary carrier that comprises a core layer, a first Cu foil layer, and a second Cu foil layer on both sides of the core layer. Each of these Cu foil layers consists of double Cu foils that are physically attached together. This innovative approach enhances the manufacturing process of coreless substrates, showcasing Gao's expertise in semiconductor materials.

Career Highlights

Gao is currently employed at Zhuhai Access Semiconductor Co., Ltd., where he applies his knowledge and skills to advance semiconductor technologies. His work at this company has positioned him as a key player in the industry, contributing to various projects that aim to improve semiconductor manufacturing processes.

Collaborations

Gao collaborates with talented individuals such as Jian Peng and Jida Zhang. These partnerships foster a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jun Gao's contributions to semiconductor technology through his patents and work at Zhuhai Access Semiconductor Co., Ltd. highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor manufacturing.