Guangdong, China

Xianming Chen

This inventor holds 27 USPTO granted patents and 16 published patent applications, primarily in Embedded Packaging Technology. Top assignees: Zhuhai Access Semiconductor Co., Ltd, Zhuhai Access Semiconductor Co., Ltd, Zhuhai Yuexin Semiconductor Limited Liability Company. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xianming Chen. Retrieved from https://idiyas.com/inventor/xianming-chen-oty13bdz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 100.0

Average Co-Inventor Count = 4.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2025-2026

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Areas of Expertise:
Embedded Packaging
Chip Interconnection
Heat Dissipation
Manufacturing Method
Packaging Substrate
High-Density Interconnection
Liquid Cooling
Integrated Inductor
Cyclic Cooling
Flip Chip
Photosensitive Sensor
Carrier Plate
27 patents (USPTO):Explore Patents

Title: Innovations of Xianming Chen

Introduction

Xianming Chen is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of electronics, particularly in the development of embedded structures for capacitors and inductors. With a total of five patents to his name, Chen's work showcases his expertise and innovative spirit.

Latest Patents

Xianming Chen's latest patents include the "Inductor-integrating embedded support frame and substrate, and manufacturing method thereof." This invention features a core dielectric layer with a through-opening designed for embedding and installing devices. The inductor consists of a magnetic core embedded in the dielectric layer, along with an inductance coil wound around it. Additionally, he has developed a "Capacitor and inductor embedded structure and manufacturing method therefor, and substrate." This method involves a series of steps including the deposition and etching of protective layers, forming a thin film capacitor, and electroplating to create inductor and circuit layers.

Career Highlights

Throughout his career, Xianming Chen has worked with notable organizations such as Zhuhai Access Semiconductor Co., Ltd and the University of Electronic Science and Technology of China. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in his field.

Collaborations

Xianming Chen has collaborated with several professionals, including Lei Feng and Benxia Huang. These partnerships have further enhanced his innovative projects and have led to advancements in electronic components.

Conclusion

Xianming Chen's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the development of embedded structures in modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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