For the Inventor, By the Inventor

Enter assignee name

Nijmegen, Netherlands

Nexperia B.v.

USPTO Granted Patents = 126

EPO Patents = 62

Trademarks = 11

Forward Citations = 41

Loading Chart...

Loading Chart...

209 inventors (with patents filed for the assignee):

Ricardo Lagmay Yandoc (13 out of 13 patents)

Pompeo V Umali (10 out of 13 patents)

Hans-Martin Ritter (9 out of 18 patents)

4. Shun Tik Yeung (9 out of 10 patents)

5. Chi Ho Leung (8 out of 12 patents)

6. Kan Wae Lam (8 out of 10 patents)

7. Geethanadh Asam (7 out of 7 patents)

8. Jan Sonsky (7 out of 34 patents)

9. Steffen Holland (6 out of 9 patents)

10. Adam Richard Brown (6 out of 7 patents)

11. Tim Boettcher (6 out of 12 patents)

12. Johannes Josephus Theodorus Marinus Donkers (5 out of 36 patents)

13. Steven Thomas Peake (5 out of 32 patents)

14. Frank Burmeister (4 out of 4 patents)

15. Wolfgang Schnitt (4 out of 10 patents)

Core Competencies:

Semiconductor Device

Voltage Gate Driver

Trench MOSFET

ESD Protection Device

Multi-Chip Package

DC-DC Converter

Energy Harvesting System

Open-Drain Bus Repeater

High Density Carrier Tape

Chip Scale Package

Lead Frame Assembly

Curved Wafer Stage

126 patents: Sort by Forward Citations

1. 12500443 - Energy harvester to convert incident radio frequency energy to direct current as well as a corresponding method and sensor comprising the energy harvester (2025-12-16),

2. 12483235 - Voltage gate driver for a semiconductor-based transistor, as well as a power switch device, and a corresponding method (2025-11-25),

3. 12482680 - Method of aligning and placing an electronic component and a system for aligning and placing an electronic component (2025-11-25),

4. 12477834 - Semiconductor device with a clamping diode (2025-11-18),

5. 12476220 - Substrate-based package semiconductor device with side wettable flanks (2025-11-18),

6. 12463055 - Package substrate manufacturing method (2025-11-04),

7. 12457727 - High density carrier tape (2025-10-28),

8. 12444673 - Electronic package and method for manufacturing the same (2025-10-14),

9. 12433001 - Semiconductor device and method of manufacture (2025-09-30),

10. 12414382 - ESD protection device (2025-09-09),

11. 12401357 - Area efficient bidirectional switch with off state injection current control (2025-08-26),

12. 12394747 - Curved wafer stage (2025-08-19),

13. 12366872 - Electronic device with reduced process spread bandgap (2025-07-22),

14. 12355353 - Trench-gate semiconductor device and method for manufacturing the same (2025-07-08),

15. 12347751 - Semiconductor device and a method of manufacture (2025-07-01),

Nexperia B.V. is a worldwide leader in the manufacturing and supply of discrete, logic and power semiconductor components. With a team of highly skilled professionals and a commitment to innovation, Nexperia offers reliable and efficient solutions to meet the growing demands of various industries including automotive, communication, and consumer electronics. Visit their website to learn more about their products, technologies, and global presence.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

126 Patents

#1 in Nijmegen

#73 in Netherlands

#6,174 in the World

Nijmegen, Netherlands

Nexperia B.v.

Forward Citations = 41

209 inventors:

Ricardo Lagmay Yandoc (13 out of 13 patents)

Pompeo V Umali (10 out of 13 patents)

Hans-Martin Ritter (9 out of 18 patents)

4. Shun Tik Yeung (9 out of 10 patents)

5. Chi Ho Leung (8 out of 12 patents)

Please report any incorrect information to support@idiyas.com

Loading…