The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Dec. 20, 2023
Zhuhai Access Semiconductor Co., Ltd., Zhuhai, CN;
Xianming Chen, Zhuhai, CN;
Xiaowei Xu, Zhuhai, CN;
Wenjian Lin, Zhuhai, CN;
Benxia Huang, Zhuhai, CN;
Gao Huang, Zhuhai, CN;
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD., Doumen, CN;
Abstract
A method for manufacturing an embedded and packaged heat dissipation structure includes: forming a semi-finished plate, the semi-finished plate including an embedded device and a first metal layer attached to a non-pin surface of the embedded device; forming a heat dissipation plate attached to the non-pin surface of the embedded device; manufacturing a heat dissipation copper column; providing a dielectric layer covering the heat dissipation copper column; laminating a second metal layer; partially etching the second metal layer and the dielectric layer to form a microchannel in which the heat dissipation copper column and the heat dissipation plate are arranged; removing a remaining part of the second metal layer; and laminating a sealing layer on the dielectric layer to seal the microchannel in a direction perpendicular to a semi-finished plate to obtain the embedded and packaged heat dissipation structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile