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Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

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USPTO Granted Patents = 18

Forward Citations = 0

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12 inventors (with patents filed for the assignee):

Benxia Huang (18 out of 54 patents)

Xianming Chen (18 out of 28 patents)

Gao Huang (13 out of 18 patents)

4. Wenjian Lin (8 out of 8 patents)

5. Lei Feng (7 out of 62 patents)

6. Yejie Hong (7 out of 7 patents)

7. Xiaowei Xu (4 out of 7 patents)

8. Jindong Feng (4 out of 5 patents)

9. Juchen Huang (3 out of 4 patents)

10. Zhijun Zhang (2 out of 11 patents)

11. Jiangjiang Zhao (1 out of 1 patent)

12. Wenshi Wang (1 out of 1 patent)

18 patents: Sort by Forward Citations

1. 12777904 - Substrate manufacturing method for an embedded substrate having a device adhering area (2026-10-27),

2. 12765372 - Method for manufacturing embedded and packaged heat dissipation structure (2026-10-13),

3. 12757784 - Package structure with wettable side surface and manufacturing method thereof, and vertical package module (2026-10-06),

4. 12684703 - Method for manufacturing a packaging substrate, and packaging substrate (2026-07-14),

5. 12672557 - Chip high-density interconnection package structure and manufacturing method thereof (2026-06-30),

6. 12672529 - Manufacturing method for device embedded packaging structure (2026-06-30),

7. 12653053 - Packaging structure and manufacturing method thereof (2026-06-09),

8. 12648437 - Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductor (2026-06-02),

9. 12642104 - Package substrate with embedded device, and manufacturing method therefor (2026-05-26),

10. 12641729 - Package substrate and manufacturing method thereof (2026-05-26),

11. 12622295 - Signal-heat separated TMV packaging structure and manufacturing method thereof (2026-05-05),

12. 12622292 - Two-sided interconnected embedded chip packaging structure and manufacturing method therefor (2026-05-05),

13. 12622091 - Light-emitting photosensitive sensor structure and manufacturing method thereof (2026-05-05),

14. 12599019 - Embedded packaging structure and manufacturing method thereof (2026-04-07),

15. 12598991 - Liquid circulating cooling package substrate and manufacturing method thereof (2026-04-07),

Company Overview

Zhuhai Access Semiconductor Co., Ltd is a prominent player in the semiconductor industry, specializing in the design and manufacture of advanced semiconductor solutions. The company focuses on developing high-performance integrated circuits and related technologies, catering to various sectors including consumer electronics, telecommunications, and automotive applications. Based in Guangdong, China, Zhuhai Access Semiconductor is committed to innovation and quality, aiming to meet the evolving needs of the global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

18 Patents

#74 in Guangdong

#1,629 in China

#34,263 in the World

Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

Forward Citations = 0

12 inventors:

Benxia Huang (18 out of 54 patents)

Xianming Chen (18 out of 28 patents)

Gao Huang (13 out of 18 patents)

4. Wenjian Lin (8 out of 8 patents)

5. Lei Feng (7 out of 62 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Zhuhai Access Semiconductor Co., Ltd. Retrieved from https://idiyas.com/company/zhuhai-access-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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