For the Inventor, By the Inventor

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Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

USPTO Granted Patents = 16

Forward Citations = 0

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12 inventors (with patents filed for the assignee):

Benxia Huang (16 out of 52 patents)

Xianming Chen (16 out of 26 patents)

Gao Huang (11 out of 16 patents)

4. Lei Feng (7 out of 62 patents)

5. Wenjian Lin (6 out of 6 patents)

6. Yejie Hong (5 out of 6 patents)

7. Jindong Feng (4 out of 5 patents)

8. Xiaowei Xu (3 out of 6 patents)

9. Zhijun Zhang (2 out of 11 patents)

10. Juchen Huang (2 out of 3 patents)

11. Jiangjiang Zhao (1 out of 1 patent)

12. Wenshi Wang (1 out of 1 patent)

16 patents: Sort by Forward Citations

1. 12757784 - Package structure with wettable side surface and manufacturing method thereof, and vertical package module (2026-10-06),

2. 12684703 - Method for manufacturing a packaging substrate, and packaging substrate (2026-07-14),

3. 12672557 - Chip high-density interconnection package structure and manufacturing method thereof (2026-06-30),

4. 12672529 - Manufacturing method for device embedded packaging structure (2026-06-30),

5. 12653053 - Packaging structure and manufacturing method thereof (2026-06-09),

6. 12648437 - Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductor (2026-06-02),

7. 12642104 - Package substrate with embedded device, and manufacturing method therefor (2026-05-26),

8. 12641729 - Package substrate and manufacturing method thereof (2026-05-26),

9. 12622295 - Signal-heat separated TMV packaging structure and manufacturing method thereof (2026-05-05),

10. 12622292 - Two-sided interconnected embedded chip packaging structure and manufacturing method therefor (2026-05-05),

11. 12622091 - Light-emitting photosensitive sensor structure and manufacturing method thereof (2026-05-05),

12. 12599019 - Embedded packaging structure and manufacturing method thereof (2026-04-07),

13. 12598991 - Liquid circulating cooling package substrate and manufacturing method thereof (2026-04-07),

14. 12588543 - Embedded flip chip package substrate and manufacturing method thereof (2026-03-24),

15. 12550774 - Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereof (2026-02-10),

Zhuhai Access Semiconductor Co., Ltd is a prominent player in the semiconductor industry, specializing in the design and manufacture of advanced semiconductor solutions. The company focuses on developing high-performance integrated circuits and related technologies, catering to various sectors including consumer electronics, telecommunications, and automotive applications. Based in Guangdong, China, Zhuhai Access Semiconductor is committed to innovation and quality, aiming to meet the evolving needs of the global market.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

16 Patents

#78 in Guangdong

#1,803 in China

#37,788 in the World

Guangdong, China

Zhuhai Access Semiconductor Co., Ltd

Forward Citations = 0

12 inventors:

Benxia Huang (16 out of 52 patents)

Xianming Chen (16 out of 26 patents)

Gao Huang (11 out of 16 patents)

4. Lei Feng (7 out of 62 patents)

5. Wenjian Lin (6 out of 6 patents)

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