The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Feb. 25, 2023
Zhuhai Access Semiconductor Co., Ltd., Guangdong, CN;
Xianming Chen, Guangdong, CN;
Wenjian Lin, Guangdong, CN;
Gao Huang, Guangdong, CN;
Lei Feng, Guangdong, CN;
Jindong Feng, Guangdong, CN;
Benxia Huang, Guangdong, CN;
Zhijun Zhang, Guangdong, CN;
Zhuhai ACCESS Semiconductor Co., Ltd., Guangdong, CN;
Abstract
A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.