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For the Inventor, By the Inventor

Shenzhen, China

Xianming Chen

This inventor holds 74 USPTO granted patents and 38 published patent applications and 31 EPO patents, primarily in Embedded Packaging (CPC class H04W). Top assignees: Zte Corporation, Zhuhai Access Semiconductor Co., Ltd, Xi'an Zhongxing New Software Co., Ltd.. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xianming Chen. Retrieved from https://idiyas.com/inventor/xianming-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 74 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 28(Granted Patents)

Forward Citations (Not Self Cited) = 23(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Shenzhen, CN (2016 - 2024)
  • Guangdong, CN (2019 - 2024)
  • Zhuhai, CN (2021 - 2024)

Company Filing History:

goldMedal38 out of 6,051 
 
Zte Corporation
 patents
silverMedal26 out of 35 
 
Zhuhai Access Semiconductor Co., Ltd
 patents
bronzeMedal10 out of 519 
 
Xi'an Zhongxing New Software Co., Ltd.
 patents

Years Active: 2016-2025

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Areas of Expertise:
Embedded Packaging
Signal Transmission
Heat Dissipation
Substrate Manufacturing
Multi-Device Integration
Optoelectronic Transmission
Antenna Packaging
Conductive Substrate
Cavity Substrate
Resource Allocation
Data Transmission
Connector Design
74 patents (USPTO):Explore Patents
1. 12412843 - Support frame structure and manufacturing method thereof (2025-09-09),
2. 12279377 - Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same (2025-04-14),
3. 12278227 - Hybrid embedded packaging structure and manufacturing method thereof (2025-04-14),
4. 12256265 - Data transmission method and apparatus, and storage medium (2025-03-18),
5. 12230581 - Multi-device graded embedding package substrate and manufacturing method thereof (2025-02-18),
6. 12166700 - System and method for transmitting a signal (2024-12-10),
7. 12148676 - Embedded chip package and manufacturing method thereof (2024-11-19),
8. 12074115 - Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate (2024-08-27),
9. 12040526 - Method for manufacturing embedded package structure having air resonant cavity (2024-07-16),
10. 12040272 - Connector for implementing multi-faceted interconnection (2024-07-16),
11. 12002734 - Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof (2024-06-04),
12. 11984414 - Packaging structure with antenna and manufacturing method thereof (2024-05-14),
13. 11961743 - Substrate manufacturing method for realizing three-dimensional packaging (2024-04-16),
14. 11942465 - Embedded structure, manufacturing method thereof and substrate (2024-03-26),
15. 11924012 - Signal transmitting method, device, and storage medium (2024-03-05),

Title: Xianming Chen - Innovator from Shenzhen, CN

Introduction:

Xianming Chen is a renowned inventor hailing from the vibrant city of Shenzhen, China. With a passion for innovation and a keen eye for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents:

Xianming Chen's latest patents include groundbreaking designs in the field of artificial intelligence and renewable energy technologies. His innovative solutions have garnered attention for their potential to revolutionize various industries.

Career Highlights:

Throughout his illustrious career, Xianming Chen has been instrumental in developing cutting-edge products that have pushed the boundaries of what is possible. His dedication to research and development has led to the creation of patents that have improved the lives of many.

Collaborations:

Xianming Chen has collaborated with leading research institutions and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has resulted in successful partnerships that have accelerated the pace of innovation.

Conclusion:

In conclusion, Xianming Chen stands as a visionary inventor whose work continues to inspire and shape the future of technology. His relentless pursuit of excellence and commitment to creating impactful inventions make him a true pioneer in the world of patents and innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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