The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Sep. 28, 2022
Applicant:

Zhuhai Access Semiconductor Co., Ltd, Guangdong, CN;

Inventors:

Xianming Chen, Guangdong, CN;

Xiaowei Xu, Guangdong, CN;

Gao Huang, Guangdong, CN;

Benxia Huang, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 (2005.12); H05K 1/02 (2005.12); H05K 3/00 (2005.12); H05K 3/46 (2005.12);
U.S. Cl.
CPC ...
H05K 3/064 (2012.12); H05K 1/0298 (2012.12); H05K 3/0044 (2012.12); H05K 3/4647 (2012.12); H05K 2201/0376 (2012.12); H05K 2201/08 (2012.12); H05K 2203/025 (2012.12); H05K 2203/061 (2012.12); H05K 2203/143 (2012.12); H05K 2203/1446 (2012.12);
Abstract

A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.


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