The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Aug. 25, 2021
Zhuhai Access Semiconductor Co., Ltd, Guangdong, CN;
Xianming Chen, Guangdong, CN;
Lei Feng, Guangdong, CN;
Benxia Huang, Guangdong, CN;
Jindong Feng, Guangdong, CN;
Minxiong Li, Guangdong, CN;
Shigui Xin, Guangdong, CN;
Wenshi Wang, Guangdong, CN;
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD, Guangdong, CN;
Abstract
A circuit prearranged heat dissipation embedded packaging structure according to an embodiment of the present disclosure includes at least one chip and a support frame surrounding the at least one chip. The support frame may include a via pillar passing through the support frame in the height direction, a first wiring layer on a first surface of the support frame, and a heat dissipation layer on the back face of the chip. The first wiring layer is flush with or higher than the first surface, the first wiring layer is in conductive connection with the heat dissipation layer, a gap between the chip and the frame is completely filled with the dielectric material, a second wiring layer is formed on a terminal face of the chip, and the second wiring layer is in conductive connection with the first wiring layer through the via pillar.