Jindong Feng

Title: Jindong Feng: Innovations in Embedded Chip Packaging and Support Frame Structures

Introduction:

In the world of innovations and patents, Jindong Feng, based in Zhuhai, CN, has emerged as a distinguished inventor. With an impressive portfolio comprising two patents, Feng has made significant contributions to the field of embedded chip package design and support frame structures. This article explores his latest patents, career highlights, and collaborations, shining a spotlight on his remarkable expertise.

Latest Patents:

One of Jindong Feng's recent patents is an embedded chip package and its manufacturing method. This innovative package includes at least one chip surrounded by a frame, with the gap between them being entirely filled with a photosensitive polymer dielectric. The terminal face of the chip is coplanar with the frame, and it features a first wiring layer on the terminal face and a second wiring layer on the back face of the chip. This patent demonstrates Feng's proficiency in developing advanced chip packaging solutions.

Another noteworthy patent held by Feng is for a support frame structure and its manufacturing method. The method entails the creation of a metal plate with a support region and an opening region. By employing photolithography, upper and lower dielectric holes are formed on the respective surfaces of the support region, connected by a metal spacer. This technology allows for the formation of upper and lower metal pillars, which are subsequently covered by dielectric layers. Feng's support frame structure patent highlights his expertise in manufacturing innovative and efficient structural components.

Career Highlights:

Jindong Feng has been associated with Zhuhai Access Semiconductor Co., Ltd. His work in this organization has been instrumental in driving forward advancements in semiconductor packaging and related technologies. Feng's patents showcase his ability to combine technical expertise with practical implementation for the benefit of the industry.

Collaborations:

While Jindong Feng has shown immense prowess as an individual inventor, his achievements have been further enhanced through collaborations with esteemed colleagues. Notable among them are Xianming Chen and Benxia Huang, who have contributed their skills and knowledge to the shared goal of pushing the boundaries of innovation in the field of embedded chip packaging and support frame structures. These collaborations have fostered an environment of cross-pollination of ideas and expertise, leading to groundbreaking inventions.

Conclusion:

Jindong Feng's exemplary work in the realm of embedded chip packaging and support frame structures has earned him recognition as a distinguished inventor in the field. With his latest patents showcasing his ingenuity and commitment to technological advancements, Feng has established himself as a valuable contributor to the industry. His collaborations with talented peers further highlight his ability to work in teams and drive innovation collectively. We look forward to witnessing more groundbreaking inventions from Jindong Feng in the future.