The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Sep. 22, 2020
Applicant:

Zhuhai Access Semiconductor Co., Ltd, Zhuhai, CN;

Inventors:

Xianming Chen, Zhuhai, CN;

Jindong Feng, Zhuhai, CN;

Benxia Huang, Zhuhai, CN;

Lei Feng, Zhuhai, CN;

Jiangjiang Zhao, Zhuhai, CN;

Wenshi Wang, Zhuhai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4857 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01);
Abstract

Disclosed are a method for manufacturing a support frame structure and a support frame structure. The method includes steps of: providing a metal plate including a support region and an opening region; forming an upper dielectric hole and a lower dielectric hole respectively at an upper surface and a lower surface of the support region by photolithography, with a metal spacer connected between the upper dielectric hole and the lower dielectric hole; forming an upper metal pillar on an upper surface of the metal plate, and laminating an upper dielectric layer which covers the upper metal pillar and the upper dielectric hole; etching the metal spacer, forming a lower metal pillar on the lower surface of the metal plate, and laminating a lower dielectric layer which covers the lower metal pillar and the lower dielectric hole.


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