Shigui Xin

Title: Shigui Xin: Innovator in Circuit Packaging Technology

Introduction

Shigui Xin is a notable inventor based in Guangdong, China. He has made significant contributions to the field of circuit packaging technology. His innovative approach has led to the development of a unique patent that addresses heat dissipation in electronic devices.

Latest Patents

Shigui Xin holds a patent for a "Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof." This invention includes at least one chip and a support frame that surrounds the chip. The support frame features a via pillar that passes through it in the height direction. Additionally, it has a first wiring layer on one surface and a heat dissipation layer on the back face of the chip. The design ensures that the first wiring layer is flush with or higher than the first surface, and it is in conductive connection with the heat dissipation layer. The gap between the chip and the frame is filled with dielectric material, and a second wiring layer is formed on the terminal face of the chip, connecting with the first wiring layer through the via pillar.

Career Highlights

Shigui Xin is currently employed at Zhuhai Access Semiconductor Co., Ltd. His work at this company has allowed him to focus on advancing semiconductor technologies. His innovative designs have the potential to improve the efficiency and performance of electronic devices.

Collaborations

Shigui Xin collaborates with talented individuals in his field, including Xianming Chen and Lei Feng. Their combined expertise contributes to the development of cutting-edge technologies in circuit packaging.

Conclusion

Shigui Xin is a prominent inventor whose work in circuit packaging technology has made a significant impact. His patent for a heat dissipation embedded packaging structure showcases his innovative thinking and dedication to improving electronic device performance.