The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Feb. 27, 2023
Applicant:

Zhuhai Access Semiconductor Co., Ltd., Guangdong, CN;

Inventors:

Xianming Chen, Guangdong, CN;

Xiaowei Xu, Guangdong, CN;

Juchen Huang, Guangdong, CN;

Benxia Huang, Guangdong, CN;

Gao Huang, Guangdong, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01);
Abstract

A manufacturing method for a substrate embedded with integrated inductor includes: providing a bearing plate; manufacturing a first conduction copper column on the bearing plate; arranging a first dielectric layer on the bearing plate which covers the first conduction copper column; opening the first dielectric layer to form a first opening; filling a magnetic material at the first opening; grinding the first dielectric layer so that surfaces of the first conduction copper column and the magnetic material are flush with a surface of the first dielectric layer; removing the bearing plate, etching a metal layer on the surface of the first dielectric layer to form a package substrate; arranging a first circuit layer and a solder mask layer on an upper surface and a lower surface of the package substrate; and forming a window in the solder mask layer corresponding to the first circuit layer.


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