The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 01, 2022
Applicant:

Zhuhai Access Semiconductor Co., Ltd, Guangdong, CN;

Inventors:

Xianming Chen, Guangdong, CN;

Wenshi Wang, Guangdong, CN;

Lei Feng, Guangdong, CN;

Benxia Huang, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01L 23/31 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01F 17/0013 (2013.01); H01F 17/045 (2013.01); H01F 27/292 (2013.01); H01F 41/0246 (2013.01); H01F 41/046 (2013.01); H01L 23/3121 (2013.01); H05K 1/165 (2013.01); H05K 3/4682 (2013.01); H01F 2017/048 (2013.01);
Abstract

An inductor-integrating embedded support frame according to an embodiment of the present disclosure includes a core dielectric layer, a through-opening penetrating through the core dielectric layer, wherein the through-opening is used for embedding and installing a device, and an inductor, wherein the inductor includes a magnetic core embedded in the core dielectric layer and an inductance coil wound around the magnetic core, wherein at least one conductive copper pillar penetrating through the core dielectric layer is provided at the periphery of the through-opening and the inductor.


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