Jida Zhang

Title: Jida Zhang: Innovator from Guangdong Revolutionizing Coreless Substrate Manufacturing

Introduction:

Jida Zhang, a talented inventor hailing from Guangdong, China, has made significant contributions in the field of coreless substrate manufacturing. With one patented invention to his name, Zhang has revolutionized the industry by developing a method that enhances the efficiency and quality of substrate production. Let's delve into his latest patents, career highlights, and collaborations to get a better understanding of Zhang's remarkable achievements.

Latest Patents:

Zhang's notable patent is titled "Method for Manufacturing Coreless Substrate." This groundbreaking invention introduces a temporary carrier composed of a core layer, a first Cu foil layer, and a second Cu foil layer. Notably, each of these foil layers consists of double Cu foils that are physically attached together. This innovative method has paved the way for more efficient and advanced coreless substrate manufacturing processes.

Career Highlights:

Jida Zhang is a valued member of the esteemed Zhuhai Access Semiconductor Co., Ltd. (ZASC). Operating within the semiconductor industry, ZASC represents a key player in the development and manufacture of state-of-the-art electronic components. Zhang's contributions have undoubtedly been instrumental in propelling the company's success and fostering their reputation for innovation.

Collaborations:

In his journey as an inventor, Jida Zhang has had the privilege of collaborating with fellow experts in the field. Notably, his work has been closely integrated with that of Xianming Chen and Jian Peng. Together, they have shared invaluable insights and experiences, pushing the boundaries of coreless substrate manufacturing to new heights. The collaborative efforts of these talented individuals underline the significance of teamwork in fostering groundbreaking innovations.

Conclusion:

Jida Zhang's remarkable invention of the "Method for Manufacturing Coreless Substrate" has significantly impacted the semiconductor industry, improving the efficiency and quality of substrate production. In his role at Zhuhai Access Semiconductor Co., Ltd., Zhang has demonstrated a strong commitment to innovation and has been a driving force behind the company's success. Collaborations with esteemed colleagues like Xianming Chen and Jian Peng further highlight Zhang's dedication to pushing the boundaries of technological advancements. With his inventive spirit and expertise, Jida Zhang continues to make substantial contributions to the field of coreless substrate manufacturing, shaping the future of electronic components.