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Sokudo Co., Ltd.

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USPTO Granted Patents = 58

% Expired Patents = 19.0

Trademarks = 1

Forward Citations = 354

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73 inventors (with patents filed for the assignee):

Koji Kaneyama (11 out of 43 patents)

Tadashi Miyagi (9 out of 26 patents)

Harald Herchen (9 out of 71 patents)

4. David H Quach (9 out of 29 patents)

5. Shuichi Yasuda (8 out of 37 patents)

6. Masashi Kanaoka (8 out of 17 patents)

7. Kazuhito Shigemori (7 out of 16 patents)

8. Tetsuya Ishikawa (7 out of 108 patents)

9. Tetsuya Hamada (6 out of 23 patents)

10. Tsuyoshi Mitsuhashi (5 out of 29 patents)

11. Tsuyoshi Okumura (5 out of 9 patents)

12. Yoshiteru Fukutomi (5 out of 27 patents)

13. Toru Asano (5 out of 7 patents)

14. Akihiro Hisai (5 out of 13 patents)

15. Martin Jeff Salinas (5 out of 12 patents)

Core Competencies:

Substrate Processing

Thermal Treatment

Cleaning Apparatus

Substrate Transport

Heat-Treating Film

Temperature Measurement

Multi-Channel Developer

Wafer Detection

Integrated Cleaning Unit

Cluster Tool Optimization

Photoresist Dispense

Real-Time Measurement

58 patents: Sort by Forward Citations

1. 8851769 - Substrate processing method (2014-10-07),

2. 8851008 - Parallel substrate treatment for a plurality of substrate treatment lines (2014-10-07),

3. 8827621 - Substrate processing apparatus, storage device, and method of transporting substrate storing container (2014-09-09),

4. 8785821 - Substrate processing apparatus with heater element held by vacuum (2014-07-22),

5. 8781308 - Apparatus for and method of heat-treating film formed on surface of substrate (2014-07-15),

6. 8708587 - Substrate treating apparatus with inter-unit buffers (2014-04-29),

7. 8635968 - Substrate processing apparatus and substrate processing method (2014-01-28),

8. 8631809 - Substrate processing apparatus (2014-01-21),

9. 8585830 - Substrate processing apparatus and substrate processing method (2013-11-19),

10. 8580340 - Substrate processing apparatus and substrate processing method (2013-11-12),

11. 8545118 - Substrate treating apparatus with inter-unit buffers (2013-10-01),

12. 8540824 - Substrate processing method (2013-09-24),

13. 8496761 - Substrate processing apparatus and substrate processing method (2013-07-30),

14. 8477301 - Substrate processing apparatus, substrate processing system and inspection/periphery exposure apparatus (2013-07-02),

15. 8460476 - Apparatus for and method of processing substrate subjected to exposure process (2013-06-11),

Company Overview

Sokudo Co., Ltd., based in Kyoto, Japan, specializes in advanced substrate processing technologies essential for semiconductor manufacturing. The company focuses on developing innovative solutions in thermal treatment, cleaning apparatus, and substrate transport systems. With expertise in heat-treating films and precise temperature measurement, Sokudo enhances the efficiency and reliability of wafer detection and processing. Their commitment to research and development positions them as a key player in the semiconductor industry, driving advancements in substrate technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

58 Patents

#60 in Kyoto 615-0031

#1,574 in Japan

#12,415 in the World

Sokudo Co., Ltd.

Forward Citations = 354

73 inventors:

Koji Kaneyama (11 out of 43 patents)

Tadashi Miyagi (9 out of 26 patents)

Harald Herchen (9 out of 71 patents)

4. David H Quach (9 out of 29 patents)

5. Shuichi Yasuda (8 out of 37 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sokudo Co., Ltd.. Retrieved from https://idiyas.com/company/sokudo-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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