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Jiangyin, China

Sj Semiconductor (jiangyin) Corporation

USPTO Granted Patents = 69

Forward Citations = 19

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21 inventors (with patents filed for the assignee):

Chengchung Lin (64 out of 66 patents)

Yenheng Chen (51 out of 52 patents)

Chengtar Wu (35 out of 37 patents)

4. Jangshen Lin (28 out of 29 patents)

5. Chihon Ho (4 out of 4 patents)

6. Yuedong Qiu (4 out of 4 patents)

7. Mingchih Chen (4 out of 4 patents)

8. Xingtao Xue (4 out of 4 patents)

9. Hailin Zhao (3 out of 3 patents)

10. Yayuan Xue (3 out of 3 patents)

11. Jiashan Yin (3 out of 3 patents)

12. Zuyuan Zhou (3 out of 3 patents)

13. Hanlung Tsai (3 out of 3 patents)

14. Chentar Wu (2 out of 2 patents)

15. Qifeng Cai (2 out of 2 patents)

Core Competencies:

Wafer-Level Packaging

3D Integrated Substrate

Antenna Packaging

Fan-Out Packaging

Semiconductor Structure

LED Packaging

Chip Packaging

Heat Sink Integration

Electromagnetic Wave Radiation

Three-Dimensional Stacking

Antenna Module

Packaging Method

69 patents: Sort by Forward Citations

1. 12512411 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-12-30),

2. 12482759 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-11-25),

3. 12283493 - Packaging structure radiating electromagnetic waves in horizontal direction and method making the same (2025-04-21),

4. 12255159 - Antenna chip packaging structure and method for preparing same (2025-03-18),

5. 12198942 - Packaging structure and method for preparing same (2025-01-14),

6. 12132036 - Fan-out LED packaging structure and method (2024-10-29),

7. 12119295 - Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof (2024-10-15),

8. 12113045 - Three-dimensional stacked fan-out packaging structure and method making the same (2024-10-08),

9. 12040546 - Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same (2024-07-16),

10. 11973070 - Double-layer stacked 3D fan-out packaging structure and method making the same (2024-04-30),

11. 11973046 - Semiconductor structure and method for preparing the same (2024-04-30),

12. 11894357 - System-level packaging structure and method for LED chip (2024-02-06),

13. 11894243 - Wafer system-level fan-out packaging structure and manufacturing method (2024-02-06),

14. 11862595 - Packaging method for fan-out wafer-level packaging structure (2024-01-02),

15. 11842976 - Semiconductor package structure with heat sink and method preparing the same (2023-12-12),

SJ Semiconductor (Jiangyin) Corporation specializes in the manufacturing and distribution of high-quality semiconductors. With a focus on advanced technology and innovation, the company delivers a wide range of semiconductor solutions for various industries, including automotive, telecommunications, consumer electronics, and more. SJ Semiconductor is committed to providing reliable and efficient products while maintaining exceptional customer service.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

69 Patents

#1 in Jiangyin

#424 in China

#10,481 in the World

Jiangyin, China

Sj Semiconductor (jiangyin) Corporation

Forward Citations = 19

21 inventors:

Chengchung Lin (64 out of 66 patents)

Yenheng Chen (51 out of 52 patents)

Chengtar Wu (35 out of 37 patents)

4. Jangshen Lin (28 out of 29 patents)

5. Chihon Ho (4 out of 4 patents)

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