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For the Inventor, By the Inventor

Jiangyin, China

Chengchung Lin

USPTO Granted Patents = 65 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 19(Granted Patents)

Forward Citations (Not Self Cited) = 15(Oct 12, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal63 out of 68 
 
Sj Semiconductor (jiangyin) Corporation
 patents
silverMedal2 out of 2 
 
Hauwei Device Co., Ltd.
 patents
bronzeMedal1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2018-2025

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65 patents (USPTO):
1. 12482759 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-11-25),
2. 12283493 - Packaging structure radiating electromagnetic waves in horizontal direction and method making the same (2025-04-21),
3. 12198942 - Packaging structure and method for preparing same (2025-01-14),
4. 12132036 - Fan-out LED packaging structure and method (2024-10-29),
5. 12119295 - Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof (2024-10-15),
6. 12113045 - Three-dimensional stacked fan-out packaging structure and method making the same (2024-10-08),
7. 12040546 - Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same (2024-07-16),
8. 11973070 - Double-layer stacked 3D fan-out packaging structure and method making the same (2024-04-30),
9. 11973046 - Semiconductor structure and method for preparing the same (2024-04-30),
10. 11894357 - System-level packaging structure and method for LED chip (2024-02-06),
11. 11894243 - Wafer system-level fan-out packaging structure and manufacturing method (2024-02-06),
12. 11842976 - Semiconductor package structure with heat sink and method preparing the same (2023-12-12),
13. 11798888 - Chip packaging structure and method for preparing same (2023-10-24),
14. 11756942 - Fan-out packaging structure and method (2023-09-12),
15. 11756871 - Fan-out packaging structure and method (2023-09-12),

Title: The Innovative Journey of Chengchung Lin

Introduction: Chengchung Lin, a pioneering inventor hailing from Jiangyin, China, has made significant contributions to the field of innovations with his groundbreaking ideas and inventions.

Latest Patents: Chengchung Lin holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, Chengchung Lin has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have not only improved existing processes but have also opened up new possibilities in different industries.

Collaborations: Chengchung Lin has collaborated with leading research institutions, universities, and companies to further develop and commercialize his inventions. His ability to work in multidisciplinary teams has led to the successful implementation of several groundbreaking technologies.

Conclusion: Chengchung Lin's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions continue to inspire future generations to think outside the box and create solutions that shape the world we live in.

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