Chengchung Lin

This inventor holds 68 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Sj Semiconductor (Jiangyin) Corporation, Hauwei Device Co., Ltd., Other. Active years: 2018-2026.

USPTO Granted Patents = 68 (Patent Applications = 15)

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 19(Granted Patents)

Forward Citations (Not Self Cited) = 15(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

66 out of 83

Sj Semiconductor (Jiangyin) Corporation

patents

2 out of 2

Hauwei Device Co., Ltd.

patents

1 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2018-2026

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Areas of Expertise:

Chip Packaging

3D Integrated Substrate

Fan-Out Structure

Antenna Packaging

Wafer-Level Packaging

Semiconductor Structure

Heat Sink Integration

Electromagnetic Waves

LED Packaging

Stacked Packaging

Manufacturing Method

System-Level Packaging

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12550740 - Chip packaging structure and method for manufacturing same (2026-02-10),

2. 12525581 - Pop structure of three-dimensional fan-out memory and packaging method thereof (2026-01-13),

3. 12512411 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-12-30),

4. 12482759 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-11-25),

5. 12283493 - Packaging structure radiating electromagnetic waves in horizontal direction and method making the same (2025-04-21),

6. 12198942 - Packaging structure and method for preparing same (2025-01-14),

7. 12132036 - Fan-out LED packaging structure and method (2024-10-29),

8. 12119295 - Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof (2024-10-15),

9. 12113045 - Three-dimensional stacked fan-out packaging structure and method making the same (2024-10-08),

10. 12040546 - Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same (2024-07-16),

11. 11973070 - Double-layer stacked 3D fan-out packaging structure and method making the same (2024-04-30),

12. 11973046 - Semiconductor structure and method for preparing the same (2024-04-30),

13. 11894357 - System-level packaging structure and method for LED chip (2024-02-06),

14. 11894243 - Wafer system-level fan-out packaging structure and manufacturing method (2024-02-06),

15. 11842976 - Semiconductor package structure with heat sink and method preparing the same (2023-12-12),

Title: The Innovative Journey of Chengchung Lin

Introduction: Chengchung Lin, a pioneering inventor hailing from Jiangyin, China, has made significant contributions to the field of innovations with his groundbreaking ideas and inventions.

Latest Patents: Chengchung Lin holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, Chengchung Lin has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have not only improved existing processes but have also opened up new possibilities in different industries.

Collaborations: Chengchung Lin has collaborated with leading research institutions, universities, and companies to further develop and commercialize his inventions. His ability to work in multidisciplinary teams has led to the successful implementation of several groundbreaking technologies.

Conclusion: Chengchung Lin's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions continue to inspire future generations to think outside the box and create solutions that shape the world we live in.