The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Sep. 17, 2021
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
SJ Semiconductor(Jiangyin) Corporation, Jiangyin, CN;
Abstract
The present disclosure provides a chip packaging structure and a method for preparing the same. The packaging structure includes a glass substrate, metal connecting posts, a first packaging layer, a connection layer, semiconductor chips, a filler layer, a second packaging layer, a controlled collapse chip connection (C4) layer, a base substrate, and a heat sink housing. In the present disclosure, metal connecting posts are pre-formed in a glass substrate, so that the glass substrate serves as an intermediate conduction layer, and the semiconductor chips and the C4 layer are respectively formed at opposite ends of the metal connecting posts to perform electrical connections, so that the number of process steps for preparing the packaging structure is minimized and the manufacturing cost is reduced.