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Jangshen Lin

This inventor holds 29 USPTO granted patents, primarily in Antenna Packaging. Top assignees: Sj Semiconductor (Jiangyin) Corporation, Other. Active years: 2019-2025.

USPTO Granted Patents = 29

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 7(Granted Patents)

Company Filing History:

28 out of 83

Sj Semiconductor (Jiangyin) Corporation

patents

1 out of 834,411

Other

patents

Years Active: 2019-2025

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Areas of Expertise:

Wafer-Level ASIC

3D Integrated Substrate

Antenna Module

Packaging Structure

Fan-Out Design

Semiconductor Packaging

Antenna Feeder

Preparation Method

Electronic Device

Lens Antenna

Antenna Package

Integrated Power Supply

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12512411 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-12-30),

2. 12482759 - Wafer-level ASIC 3D integrated substrate, packaging device and preparation method (2025-11-25),

3. 12198942 - Packaging structure and method for preparing same (2025-01-14),

4. 11728558 - Semiconductor structure including antenna (2023-08-15),

5. 11699840 - Antenna package structure and antenna packaging method (2023-07-11),

6. 11515269 - Semiconductor packaging structure having antenna module (2022-11-29),

7. 11502392 - Packaging structure and packaging method for antenna (2022-11-15),

8. 11488915 - Antenna package structure and antenna packaging method (2022-11-01),

9. 11437707 - Antenna feeder package structure and packaging method (2022-09-06),

10. 11322852 - Lens antenna packaging structure, preparation method and electronic device (2022-05-03),

11. 11316247 - Semiconductor packaging structure having antenna module (2022-04-26),

12. 11289793 - Semiconductor packaging structure having antenna module (2022-03-29),

13. 11283152 - Antenna package structure and antenna packaging method (2022-03-22),

14. 11257772 - Fan-out antenna packaging structure and preparation method thereof (2022-02-22),

15. 11228087 - Antenna package structure and antenna packaging method (2022-01-18),

Title: The Innovative Journey of Jangshen Lin

Introduction:

Jangshen Lin, a visionary inventor hailing from Jiangyin, China, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents:

Jangshen Lin's latest patents include cutting-edge advancements in renewable energy technology, artificial intelligence, and sustainable materials.

Career Highlights:

Throughout his illustrious career, Jangshen Lin has been recognized for his pioneering work in developing innovative solutions for complex technological challenges. His inventions have revolutionized various industries, earning him a reputation as a trailblazer in the field of innovation.

Collaborations:

Jangshen Lin has collaborated with leading research institutions, universities, and multinational companies to further his research and bring his inventions to the market. His collaborative efforts have resulted in the successful implementation of cutting-edge technologies in real-world applications.

Conclusion:

In conclusion, Jangshen Lin's passion for innovation and relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations of innovators to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

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