The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Apr. 28, 2021
Applicant:

Sj Semiconductor (Jiangyin) Corporation, JiangYin, CN;

Inventors:

Yenheng Chen, JiangYin, CN;

Chengchung Lin, JiangYin, CN;

Chengtar Wu, JiangYin, CN;

Jangshen Lin, JiangYin, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01);
Abstract

The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes a rewiring layer, wherein the rewiring layer comprises a first dielectric layer and a first metal wiring layer in the first dielectric layer; metal connecting column, formed on the first metal wiring layer of the rewiring layer; a packaging layer, disposed on the rewiring layer, an antenna metal layer, formed on the packaging layer, an antenna circuit chip, bonded to the first metal layer of the rewiring layer, and electrically connected to the antenna metal layer through the metal connecting column; and a metal bump, formed on the first metal wiring layer of the rewiring layer, to achieve electrical lead-out of the rewiring layer.


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