The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Jul. 14, 2020
Applicant:
Sj Semiconductor(jiangyin) Corporation, Jiangyin, CN;
Inventors:
Jangshen Lin, Jiangyin, CN;
Yenheng Chen, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
Chengtar Wu, Jiangyin, CN;
Assignee:
SJ SEMICONDUCTOR(JIANGYIN) CORPORATION, Jiangyin, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15788 (2013.01);
Abstract
The present disclosure provides an antenna package structure and packaging method. The package structure includes: a metal joint pin fabricated by using a wire bonding process; and a packaging layer, covering the metal joint pin. An antenna circuit chip and an antenna metal layer are electrically connected to two ends of the antenna feeder package structure.