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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11699840 B1

PDFFull Text
Date of Patent:
Jul. 11, 2023

Filed:

Dec. 08, 2021

Antenna package structure and antenna packaging method

Applicant:

Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;

Inventors:

Yenheng Chen, Jiangyin, CN;

Chengchung Lin, Jiangyin, CN;

Chengtar Wu, Jiangyin, CN;

Jangshen Lin, Jiangyin, CN;

Assignee:

SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, Jiangyin, CN;

Attorney:

Alston & Bird LLP

Primary Examiner:

Jami Valentine Miller

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/95 (2013.01); H01Q 9/0421 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/014 (2013.01);
Abstract

The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.

Find Patent Forward Citations

Chen, Yenheng. (2023). Antenna package structure and antenna packaging method (U.S. Patent No. 11699840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11699840

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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