The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Mar. 15, 2019
Applicant:
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Inventors:
Yenheng Chen, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
Chengtar Wu, Jiangyin, CN;
Jangshen Lin, Jiangyin, CN;
Assignee:
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, Jiangyin, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/95 (2013.01); H01Q 9/0421 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/014 (2013.01);
Abstract
The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.