The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Mar. 25, 2022
Applicant:

Sj Semiconductor(jiangyin) Corporation, Jiangyin, CN;

Inventors:

Yenheng Chen, Jiangyin, CN;

Chengchung Lin, Jiangyin, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0087 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01Q 21/061 (2013.01); H01L 2224/16225 (2013.01);
Abstract

The present disclosure provides an antenna packaging structure radiating e-m waves in a horizontal direction and a vertical direction and a method making the same. The method includes: providing a support substrate, forming a separation layer on a surface of the support substrate; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes first antennas and second antennas arranged in an array respectively, radiating e-m waves in the horizontal direction and the vertical direction respectively; forming a molding material layer; removing the support substrate and the separation layer; forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, the solder ball bumps are electrically connected to the metal wire layer; disposing a chip on the solder ball bumps.


Find Patent Forward Citations

Loading…