The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jun. 29, 2023
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Yenheng Chen, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
SJ Semiconductor(Jiangyin) Corporation, JiangSu Province, CN;
Abstract
A wafer-level packaging structure and a method for preparing the same are provided, the wafer-level packaging structure includes at least a molding layer and a 3D IPD structure fabricated in the molding layer. The wafer-level packaging structure of the present disclosure can integrate various electronic chips and components such as millimeter wave antenna/capacitor/inductor/electric crystal/GPU/PMU/DDR/flash memory/filter, etc., with higher flexibility and wider compatibility, thus reducing package size and package cost.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile