This inventor holds 12 USPTO granted patents and 14 published patent applications. Top assignee: Sj Semiconductor (Jiangyin) Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chengchung Lin: Innovator in Semiconductor Packaging
Introduction
Chengchung Lin is a prominent inventor based in Jiangyin, China. He has made significant contributions to the field of semiconductor packaging, holding a total of 12 patents. His innovative designs and methods have advanced the technology used in electronic devices.
Latest Patents
One of his latest patents is titled "Thermally Conductive Semiconductor Packaging Structure and Method for Preparing Same." This invention features a thermally conductive semiconductor packaging structure that includes a cooling component exposed on one surface and an electrical interconnecting component on the other surface. The cooling component is designed with a thermally conductive die, which has thermally conductive members extending away from its back side, and pads on the front side for connection to the electrical interconnecting component. The electrical interconnecting component consists of electrically conductive connectors, a rewiring layer, and metal bumps that connect to the rewiring layer. Additionally, a substrate is electrically connected to the metal bumps, and a heat dissipating cover is placed over the substrate, in contact with the thermally conductive members. This packaging structure is applicable to a wide range of packages.
Another notable patent is the "Fan-Out Wafer-Level Packaging Structure and Method for Manufacturing Same." This invention further showcases his expertise in semiconductor technology.
Career Highlights
Chengchung Lin is currently employed at Sj Semiconductor (Jiangyin) Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced packaging solutions that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Chengchung has collaborated with talented individuals such as Yenheng Chen and Jin Yang. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Chengchung Lin is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing technology in electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile