The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Apr. 07, 2023
Applicant:

Sj Semiconductor(jiangyin) Corporation, Jiangyin City, CN;

Inventors:

Yenheng Chen, Jiangyin City, CN;

Chengchung Lin, Jiangyin City, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/568 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01L 2224/19 (2013.01); H01L 2224/21 (2013.01);
Abstract

A packaging structure comprising a first antenna layer on a protective layer, a dielectric layer, a first plastic packaging layer over the first antenna layer, a second conductive pillar, a chip, a redistribution layer, and a second plastic packaging layer, the first conductive pillar is electrically connected to the first antenna layer, the dielectric layer is formed over the first conductive pillar, the second antenna layer is electrically connected to the first conductive pillar, the second conductive pillar is formed over the dielectric layer and electrically connected to the second antenna layer, the chip layer is formed over the dielectric layer, the redistribution layer is provided with conductive bumps and electrically connected to the chip and the second antenna layer, and the second plastic packaging layer encapsulates the second antenna layer and the chip. Chip and multiple antennas are packaged with one carrier substrate, reducing size.


Find Patent Forward Citations

Chen, Yenheng. (2026). Packaging structure and packaging method (U.S. Patent No. 12588544). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12588544

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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