The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
May. 02, 2023
Applicant:
Sj Semiconductor(jiangyin) Corporation, Jiangyin City, CN;
Inventors:
Chengchung Lin, Jiangyin City, CN;
Jin Yang, Jiangyin City, CN;
Assignee:
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, JIANGYIN CITY, JIANGSU PROVINCE, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10W 74/121 ; H10P 72/74 ; H10W 74/117 ; H10W 74/019 ; H10W 72/221 ; H10P 72/743 ; H10P 72/744 ; H10W 72/01212 ; H10W 74/114 ; H10W 90/00 ; H10W 70/65 ; H10W 70/655 ; H10P 72/7424 ; H10W 70/60 ; H10W 70/652 ; H10W 74/01 ;
Lin, Chengchung. (2026). Fan-out wafer-level packaging structure and method for manufacturing same (U.S. Patent No. 12713968). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713968
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile