The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Aug. 07, 2023
Sj Semiconductor(jiangyin) Corporation, Jiangyin City, CN;
Yenheng Chen, Jiangyin City, CN;
Chengchung Lin, Jiangyin City, CN;
SJ Semiconductor(Jiangyin) Corporation, Jiangyin City, CN;
Abstract
A fan-out packaging structure and a method for manufacturing the same are provided. The structure comprises: a fan-out substrate unit, and a secondary fan-out unit; an effective electrical connection between a second top surface of the fan-out substrate unit and a third bottom surface of the secondary fan-out unit is formed through a second solder array, and the fan-out substrate unit comprises a first wiring layer and a second wiring layer connected by conductive posts. By having a fan-out substrate unit with a double-layer wiring layer as the substrate of the fan-out wiring layer, the present disclosure reduces the achievable minimum line width, thereby increasing the achievable line density of the fan-out package. Meanwhile, replacing the traditional substrate with the double-layer wiring layer, and preparing the fan-out substrate unit and the secondary fan-out unit separately and then combining the two, shortens the time required to prepare the whole structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile