The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Sep. 13, 2023
Sj Semiconductor(jiangyin) Corporation, Jiangyin City, CN;
Yenheng Chen, Jiangyin City, CN;
Chengchung Lin, Jiangyin City, CN;
SJ Semiconductor(Jiangyin) Corporation, JiangSu, CN;
Abstract
A method of fabricating a fan-out system-level package and structure are disclosed. The method comprises: forming a first rewiring layer over a supporting substrate; electrically connecting a connecting bridge to the first rewiring layer; forming an encapsulation layer over the first rewiring layer and the connecting bridge; forming a second rewiring layer over the encapsulation layer, and electrically connected to the connecting bridge; removing the supporting substrate, and disposing conductive blocks on a side of the first rewiring layer facing away from the encapsulation layer; electrically connecting first function chips and components to a side of the second rewiring layer facing away from the encapsulation layer; forming a cooling cover over the second rewiring layer, leaving a cavity between the cooling cover and the second rewiring layer to house the first function chips and the components; and connecting the conductive blocks to a packaging wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile