Company Filing History:
Years Active: 2020-2022
Title: **Chihon Ho: Pioneering Innovations in Antenna Packaging Technology**
Introduction
Chihon Ho is an accomplished inventor based in Jiangyin, China, recognized for his significant contributions to the field of semiconductor technology. With a portfolio that boasts four patents, he continues to push the boundaries of innovation in antenna packaging structures.
Latest Patents
Chihon Ho's latest patents include the "Fan-out antenna packaging structure and preparation method thereof." This invention presents a cutting-edge fan-out antenna packaging structure, which comprises a semiconductor chip surrounded by a plastic packaging material layer. It features a via formed within the layer that houses a conductive pole extending through the material from the top to the bottom. An antenna structure is integrated on the first surface of the plastic layer, electrically connected to the conductive pole, while a redistribution layer on the second surface connects with both the semiconductor chip and the pole. Additionally, a solder bump is incorporated to ensure electrical connection with the redistribution layer and insulation from the plastic material.
Career Highlights
Chihon Ho currently works at the Sj Semiconductor (Jiangyin) Corporation, where he employs his expertise in semiconductor technologies to develop innovative solutions. His work has made substantial contributions to advancements in antenna packaging, significantly impacting the efficiency and performance of electronic devices.
Collaborations
Throughout his career, Chihon has collaborated with talented professionals, including Yenheng Chen and Chengchung Lin. These collaborations have fostered creativity and technical advancements, further enhancing the quality of the technologies they develop.
Conclusion
Chihon Ho stands out as a brilliant inventor in the semiconductor industry with a robust patent portfolio. His innovations, particularly in fan-out antenna packaging structures, exemplify his commitment to excellence in technology. With continued dedication to research and development, he is set to remain at the forefront of semiconductor innovations.