Sj Semiconductor (jiangyin) Corporation

Chihon Ho

Chengchung Lin

Yenheng Chen

Chengtar Wu

Jangshen Lin

The present disclosure provides a fan-out antenna packaging structure and a preparation method thereof. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip, a via being formed in the plastic packaging material layer; a conductive pole located in the via and running through the plastic packaging material layer from top to bottom; an antenna structure located on a first surface of the plastic packaging material layer and electrically connected with the conductive pole; a redistribution layer located on a second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the conductive pole; and a solder bump located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.

Fan-out antenna packaging structure and preparation method thereof

The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer comprising a first surface and an opposite second surface, wherein the plastic packaging material layer packages a periphery of the semiconductor chip; a metal connecting pole located in the plastic packaging material layer and running through the plastic packaging material layer from top to bottom; an antenna structure located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting pole; are distribution layer located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting pole; and a solder bump located on a surface, insulated from the plastic packaging material layer, of the redistribution layer, and electrically connected with the redistribution layer.

The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer, comprising a first surface and a second surface opposite to the first surface, wherein the plastic packaging material layer wraps around a periphery of the semiconductor chip; a metal connecting wire disposed through the plastic packaging material layer from top to bottom; an antenna structure, located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting wire; a redistribution layer, located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting wire; and a solder ball bump, located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.

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Jiangyin, China

Chihon Ho