The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Oct. 25, 2018
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Yenheng Chen, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
Jangshen Lin, Jiangyin, CN;
Chengtar Wu, Jiangyin, CN;
Chihon Ho, Jiangyin, CN;
SJ Semiconductor (Jiangyin) Corporation, Jianyin, CN;
Abstract
The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer, comprising a first surface and a second surface opposite to the first surface, wherein the plastic packaging material layer wraps around a periphery of the semiconductor chip; a metal connecting wire disposed through the plastic packaging material layer from top to bottom; an antenna structure, located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting wire; a redistribution layer, located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting wire; and a solder ball bump, located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.