Forward Citations = 75

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14 inventors (with patents filed for the assignee):

Wei Wang (8 out of 41 patents)

Guoqing Yu (8 out of 8 patents)

Zhiqi Wang (3 out of 27 patents)

4. Qiuhong Zou (3 out of 3 patents)

5. Qinqin Xu (3 out of 3 patents)

6. Youjun Wang (3 out of 3 patents)

7. Junjie Li (2 out of 7 patents)

8. Wenbin Wang (2 out of 2 patents)

9. Qingwei Wang (2 out of 2 patents)

10. Mingda Shao (1 out of 1 patent)

11. Hanyu Li (1 out of 1 patent)

12. Xiaohua Huang (1 out of 1 patent)

13. Guoping Yu (1 out of 1 patent)

14. Quihong Zou (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 8952512 - Wafer-level package structure of light emitting diode and manufacturing method thereof (2015-02-10),

2. 8445919 - Wafer-level package structure of light emitting diode and manufacturing method thereof (2013-05-21),

3. 8174090 - Packaging structure (2012-05-08),

4. 7795074 - WLCSP target and method for forming the same (2010-09-14),

5. 7781250 - Wafer level chip size package for MEMS devices and method for fabricating the same (2010-08-24),

6. 7755155 - Packaging structure and method for fabricating the same (2010-07-13),

7. 7663213 - Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same (2010-02-16),

8. 7394152 - Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same (2008-07-01),

Company Overview

China Wafer Level CSP Ltd. is a leading provider of advanced packaging solutions for the semiconductor industry. With a focus on wafer-level chip-scale packaging (WLCSP), the company offers innovative solutions for integrating and packaging semiconductor chips. Their cutting-edge technology and expertise make them a trusted partner for leading semiconductor companies worldwide.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

8 Patents

#23 in

#3,464 in China

CN

China Wafer Level Csp Ltd.

Forward Citations = 75

14 inventors:

Wei Wang (8 out of 41 patents)

Guoqing Yu (8 out of 8 patents)

Zhiqi Wang (3 out of 27 patents)

4. Qiuhong Zou (3 out of 3 patents)

5. Qinqin Xu (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: China Wafer Level Csp Ltd.. Retrieved from https://idiyas.com/company/china-wafer-level-csp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]