CN

China Wafer Level Csp Ltd.


USPTO Granted Patents = 8

Forward Citations = 75

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14 inventors (with patents filed for the assignee):

goldMedal Wei Wang (8 out of 39 patents)

silverMedal Guoqing Yu (8 out of 8 patents)

bronzeMedal Zhiqi Wang (3 out of 27 patents)

4 Qiuhong Zou (3 out of 3 patents)

5 Qinqin Xu (3 out of 3 patents)

6 Youjun Wang (3 out of 3 patents)

7 Junjie Li (2 out of 6 patents)

8 Wenbin Wang (2 out of 2 patents)

9 Qingwei Wang (2 out of 2 patents)

10 Mingda Shao (1 out of 1 patent)

11 Hanyu Li (1 out of 1 patent)

12 Xiaohua Huang (1 out of 1 patent)

13 Guoping Yu (1 out of 1 patent)

14 Quihong Zou (1 out of 1 patent)


8 patents:

China Wafer Level CSP Ltd. is a leading provider of advanced packaging solutions for the semiconductor industry. With a focus on wafer-level chip-scale packaging (WLCSP), the company offers innovative solutions for integrating and packaging semiconductor chips. Their cutting-edge technology and expertise make them a trusted partner for leading semiconductor companies worldwide.
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USPTO Data Jan 1 1976 - Dec 2 2025

8 Patents

#26 in

#3,017 in China

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CN
Forward Citations = 75

14 inventors:

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