The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Sep. 19, 2008
Guoping Yu, Jiang Su Province, CN;
Zhiqi Wang, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
Quihong Zou, Jiang Su Province, CN;
Guoping Yu, Jiang Su Province, CN;
Zhiqi Wang, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
Quihong Zou, Jiang Su Province, CN;
China Wafer Level CSP Ltd., Jiang Su Province, CN;
Abstract
The present invention provides a packaging structure and a method for fabricating the same, the packaging structure includes a chip, a compatible pad provided on the chip, an intermediate metal layer electrically connecting with the compatible pad, a solder bump, and a redistribution metal layer electrically connecting with the solder bump, wherein the redistribution metal layer connects with the intermediate metal layer directly to form an electrical connection. Also, some connections between the redistribution metal layer and the intermediate metal layer are in a manner of concave shape, while other connections between the redistribution metal layer and the intermediate metal layer are in a manner of '-' shape, so that the number of the connections increases while the stability of connection is ensured.