Province, China

Guoqing Yu


Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 75(Granted Patents)


Location History:

  • SuZhou Industrial Park, CN (2008 - 2010)
  • Jiang Su, CN (2013)
  • Jiang Su Province, CN (2010 - 2015)

Company Filing History:


Years Active: 2008-2015

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8 patents (USPTO):Explore Patents

Title: Guoqing Yu: Innovator in Wafer-Level Packaging Technology

Introduction

Guoqing Yu is a prominent inventor based in Province, China, known for his significant contributions to the field of semiconductor packaging. With a total of 8 patents to his name, he has made remarkable advancements in the technology of light-emitting diodes (LEDs).

Latest Patents

His latest patents include a wafer-level package structure of a light-emitting diode and the manufacturing method thereof. This innovative package structure features a die, a first insulating layer, at least two wires, bumps, and an annular second insulating layer. The design reduces the area required for the substrate and allows for the extraction of electrodes without the need for gold wiring, thereby minimizing the volume of the package. The technical solution enhances the efficiency and compactness of LED packaging, which is crucial for modern electronic applications.

Career Highlights

Guoqing Yu is currently associated with China Wafer Level CSP Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of LED technology, making it more efficient and effective for various applications.

Collaborations

He has collaborated with notable colleagues such as Wei Wang and Youjun Wang, contributing to the collective expertise and innovation within their field.

Conclusion

Guoqing Yu's contributions to wafer-level packaging technology have significantly impacted the semiconductor industry. His innovative patents and ongoing work continue to push the boundaries of what is possible in LED technology.

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