The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Jan. 13, 2009
Mingda Shao, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
Hanyu LI, Jiang Su Province, CN;
Xiaohua Huang, Jiang Su Province, CN;
Mingda Shao, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
Hanyu Li, Jiang Su Province, CN;
Xiaohua Huang, Jiang Su Province, CN;
China Wafer Level CSP Ltd., Jiang Su Province, CN;
Abstract
The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.