Hanyu Li

Title: Hanyu Li: Innovator in Wafer Level Chip Size Packaging

Introduction

Hanyu Li is a notable inventor based in Province, China. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative work in Wafer Level Chip Size Packaging (WLCSP). His expertise and inventions have had a considerable impact on the industry.

Latest Patents

Hanyu Li holds a patent for a WLCSP target and method for forming the same. This invention provides a method for creating a WLCSP target by recombining single chips, wafer parts, or half-finished packaging targets onto a substrate. The method allows for the packaging of larger wafers using smaller WLCSP apparatuses, thereby reducing costs and extending the applicability of the equipment. This innovation enables enterprises to adapt to market developments without the need for substantial updates to their WLCSP apparatus.

Career Highlights

Hanyu Li is associated with China Wafer Level CSP Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has not only enhanced the efficiency of semiconductor packaging but has also contributed to the overall growth of the industry.

Collaborations

Hanyu Li has collaborated with notable colleagues, including Mingda Shao and Guoqing Yu. Their combined efforts have fostered innovation and development within their field.

Conclusion

Hanyu Li's contributions to Wafer Level Chip Size Packaging exemplify the importance of innovation in the semiconductor industry. His patent and work at China Wafer Level CSP Ltd. highlight his role as a key inventor in this evolving field.