Xiaohua Huang

Title: Innovations of Xiaohua Huang in Wafer Level Chip Size Packaging

Introduction

Xiaohua Huang is a notable inventor based in Province, China. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative work in Wafer Level Chip Size Packaging (WLCSP). His inventions have the potential to enhance the efficiency and cost-effectiveness of semiconductor manufacturing.

Latest Patents

Xiaohua Huang holds a patent for a WLCSP target and method for forming the same. This invention provides a method for creating a WLCSP target by recombining single chips, wafer parts, or half-finished packaging targets onto a substrate. The method allows for the packaging of larger wafers using smaller WLCSP apparatuses, thereby reducing costs and extending the usability of the equipment.

Career Highlights

Xiaohua Huang is associated with China Wafer Level CSP Ltd., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of WLCSP, making it a more viable option for companies looking to keep pace with market demands.

Collaborations

Xiaohua Huang collaborates with talented individuals such as Mingda Shao and Guoqing Yu, who contribute to the innovative environment at China Wafer Level CSP Ltd. Their teamwork fosters a culture of creativity and technical excellence.

Conclusion

Xiaohua Huang's contributions to Wafer Level Chip Size Packaging represent a significant advancement in semiconductor technology. His innovative methods and collaborative efforts continue to shape the future of the industry.