The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Jun. 04, 2008
Zhiqi Wang, SuZhou Industrial Park, CN;
Guoqing Yu, SuZhou Industrial Park, CN;
Qinqin Xu, SuZhou Industrial Park, CN;
Wei Wang, SuZhou Industrial Park, CN;
Zhiqi Wang, SuZhou Industrial Park, CN;
Guoqing Yu, SuZhou Industrial Park, CN;
Qinqin Xu, SuZhou Industrial Park, CN;
Wei Wang, SuZhou Industrial Park, CN;
China Wafer Level CSP Ltd., Suzhou Industrial Park, CN;
Abstract
The present invention provides a wafer level chip size package having cavities within which micro-machined parts are free to move, allowing access to electrical contacts, and optimized for device performance. Also a method for fabricating a wafer level chip size package for MEMS devices is disclosed. This packaging method provides a well packed device with the size much closely to the original one, making it possible to package the whole wafer at the same time and therefore, saves the cost and cycle time.