Qinqin Xu

Title: Innovations of Qinqin Xu in MEMS Device Packaging

Introduction

Qinqin Xu is a notable inventor based in Suzhou Industrial Park, China. He has made significant contributions to the field of micro-electromechanical systems (MEMS) through his innovative patent work. With a total of three patents to his name, Xu has focused on enhancing the packaging of MEMS devices, which is crucial for their performance and reliability.

Latest Patents

One of Xu's latest patents is titled "Wafer level chip size package for MEMS devices and method for fabricating the same." This invention provides a wafer-level chip size package that features cavities allowing micro-machined parts to move freely, thereby optimizing device performance while maintaining access to electrical contacts. The method disclosed in this patent enables the packaging of the entire wafer simultaneously, significantly reducing costs and cycle time.

Another significant patent by Xu is "Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same." This invention introduces a double-layer lead structure designed to accommodate an increasing number of peripheral arrayed compatible pads on semiconductor chips. This innovation not only saves space on the chip's bottom surface but also minimizes the risk of potential shorts that can occur with a one-layer lead structure.

Career Highlights

Qinqin Xu is currently employed at China Wafer Level CSP Ltd., where he continues to develop cutting-edge technologies in MEMS device packaging. His work has positioned him as a key player in the semiconductor industry, particularly in the realm of wafer-level packaging solutions.

Collaborations

Xu collaborates with talented individuals such as Guoqing Yu and Wei Wang, who contribute to the innovative environment at China Wafer Level CSP Ltd. Their combined expertise fosters advancements in MEMS technology and packaging methods.

Conclusion

Qinqin Xu's contributions to MEMS device packaging through his patents demonstrate his commitment to innovation in the semiconductor field. His work not only enhances device performance but also streamlines manufacturing processes, making significant strides in technology.