The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
May. 01, 2009
Zhiqi Wang, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Qiuhong Zou, Jiang Su Province, CN;
Youjun Wang, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
Zhiqi Wang, Jiang Su Province, CN;
Guoqing Yu, Jiang Su Province, CN;
Qiuhong Zou, Jiang Su Province, CN;
Youjun Wang, Jiang Su Province, CN;
Wei Wang, Jiang Su Province, CN;
China Wafer Level CSP Ltd., Jiang Su Province, CN;
Abstract
The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing from a back side of the chip to the pad is provided on the chip, and the intermediate metal layer is connected to the pad within the through hole. In the packaging structure, a through hole is formed on the back side of the chip to expose the pad on the front side of the chip and the intermediate metal layer is connected to the pad within the through hole. This provides a relatively large contacting area therebetween. The connection thus formed is more reliable and stable, compared with the prior art structure.