This inventor holds 3 USPTO granted patents. Top assignee: China Wafer Level Csp Ltd.. Active years: 2008-2012.
Location History:
- SuZhou Industrial Park, CN (2008 - 2010)
- Jiang Su Province, CN (2012)
Company Filing History:
Years Active: 2008-2012
Title: Youjun Wang: Innovator in Packaging Technology
Introduction
Youjun Wang is a prominent inventor based in Suzhou Industrial Park, China. He has made significant contributions to the field of packaging technology, holding a total of 3 patents. His work focuses on enhancing the reliability and efficiency of packaging structures in semiconductor devices.
Latest Patents
One of his latest patents is a packaging structure that includes a solder bump, a pad located on the front side of a chip, and an intermediate metal layer connecting the solder bump and the pad. This innovative design features a through hole that passes from the back side of the chip to the pad, allowing for a larger contacting area and a more reliable connection compared to prior art structures. Another notable patent is for a wafer level chip size packaged chip device with a double-layer lead structure. This invention addresses the increasing density of peripheral arrayed compatible pads on semiconductor chips, providing a solution that saves space and reduces the risk of potential shorts.
Career Highlights
Youjun Wang is currently employed at China Wafer Level CSP Ltd., where he continues to develop cutting-edge packaging solutions. His expertise in this area has positioned him as a key player in the semiconductor industry.
Collaborations
He has collaborated with notable coworkers, including Guoqing Yu and Wei Wang, contributing to various projects that enhance the capabilities of semiconductor packaging.
Conclusion
Youjun Wang's innovative work in packaging technology has led to significant advancements in the semiconductor industry. His patents reflect a commitment to improving the reliability and efficiency of electronic devices.