This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: China Wafer Level Csp Ltd.. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Guoping Yu: Innovator in Packaging Technology
Introduction
Guoping Yu is a notable inventor based in Province, China. He has made significant contributions to the field of packaging technology, particularly through his innovative patent.
Latest Patents
Guoping Yu holds a patent for a "Packaging structure and method for fabricating the same." This invention provides a unique packaging structure that includes a chip, a compatible pad, an intermediate metal layer, a solder bump, and a redistribution metal layer. The design ensures electrical connections are stable and efficient, with various connection shapes enhancing the overall reliability of the packaging.
Career Highlights
Guoping Yu is associated with China Wafer Level CSP Ltd., where he applies his expertise in developing advanced packaging solutions. His work has been instrumental in improving the performance and reliability of electronic components.
Collaborations
Guoping Yu collaborates with talented individuals such as Zhiqi Wang and Guoqing Yu, contributing to a dynamic team focused on innovation in packaging technology.
Conclusion
Guoping Yu's contributions to packaging technology exemplify the importance of innovation in the electronics industry. His patent reflects a commitment to enhancing product reliability and performance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile