This inventor holds 1 USPTO granted patent. Top assignee: China Wafer Level Csp Ltd.. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Quihong Zou: Innovator in Packaging Technology
Introduction
Quihong Zou is a notable inventor based in Province, China. He has made significant contributions to the field of packaging technology, particularly through his innovative patent.
Latest Patents
His most recent patent is titled "Packaging structure and method for fabricating the same." This invention provides a unique packaging structure that includes a chip, a compatible pad, an intermediate metal layer, a solder bump, and a redistribution metal layer. The design ensures electrical connections are stable and efficient, with various connection shapes enhancing the overall reliability of the packaging.
Career Highlights
Quihong Zou is associated with China Wafer Level CSP Ltd., where he applies his expertise in packaging technology. His work has led to advancements in the efficiency and stability of electronic packaging solutions.
Collaborations
He collaborates with talented coworkers, including Guoping Yu and Zhiqi Wang, contributing to a dynamic team focused on innovation in their field.
Conclusion
Quihong Zou's contributions to packaging technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a commitment to enhancing the reliability and efficiency of electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile