Wenbin Wang

Title: Innovations of Wenbin Wang in Wafer-Level Packaging

Introduction

Wenbin Wang is a notable inventor based in Province, China, recognized for his contributions to the field of light-emitting diode (LED) packaging technology. With a total of two patents to his name, he has made significant advancements in wafer-level package structures.

Latest Patents

Wenbin Wang's latest patents focus on the development of a wafer-level package structure for light-emitting diodes and the associated manufacturing methods. The first patent describes a structure that includes a die, a first insulating layer, at least two wires, bumps, and an annular second insulating layer. This innovative design reduces the area required for the substrate and allows for the extraction of electrodes without the need for gold wiring, thereby minimizing the package volume. The second patent reiterates similar features, emphasizing the arrangement of leads on opposite sides of the substrate, which further optimizes space and efficiency in LED packaging.

Career Highlights

Wenbin Wang is currently employed at China Wafer Level CSP Ltd., where he continues to push the boundaries of technology in the semiconductor industry. His work has been instrumental in enhancing the performance and efficiency of LED packaging solutions.

Collaborations

Wenbin has collaborated with notable colleagues such as Junjie Li and Qiuhong Zou, contributing to a dynamic team focused on innovation in wafer-level packaging technologies.

Conclusion

Wenbin Wang's contributions to the field of LED packaging through his innovative patents and collaborative efforts highlight his role as a key figure in advancing semiconductor technology. His work continues to influence the industry and pave the way for future innovations.