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For the Inventor, By the Inventor

Portland, OR, United States of America

Paul B Fischer

This inventor holds 112 USPTO granted patents and 37 published patent applications and 1 EPO patent, primarily in III-N Transistor Technology (CPC class H01L29-2003). Top assignee: Intel Corporation. Active years: 1997-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul B Fischer. Retrieved from https://idiyas.com/inventor/paul-b-fischer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 112 

% Patents Active = 79.5

 

Average Co-Inventor Count = 4.8

ph-index = 6

Forward Citations = 181(Granted Patents)

Forward Citations (Not Self Cited) = 146(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hillsboro, OR (US) (1997 - 2002)
  • Portland, OR (US) (2005 - 2024)

Company Filing History:

goldMedal112 out of 56,394 
 
Intel Corporation
 patents

Years Active: 1997-2026

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Areas of Expertise:
III-N Transistors
Gallium Nitride
Acoustic Resonators
Microelectronic Assemblies
Integrated Circuits
RF Filters
Transistor Fabrication
Quantum Wells
Field Effect Transistors
Device Integration
Semiconductor Regrowth
Epitaxial Layers
112 patents (USPTO):Explore Patents
1. 12672355 - Gallium nitride (GaN) epitaxy on patterned substrate for integrated circuit technology (2026-06-30),
2. 12548973 - Hybrid laser with amorphous bonding layer (2026-02-10),
3. 12375060 - Digitally controlled lithographically-defined multi-frequency acoustic resonators (2025-07-29),
4. 12292608 - Gallium nitride (GaN) integrated circuit technology with optical communication (2025-05-06),
5. 12176323 - Microelectronic assemblies (2024-12-24),
6. 12148757 - Integration of Si-based transistors with non-Si technologies by semiconductor regrowth over an insulator material (2024-11-19),
7. 12148747 - Gallium nitride (GAN) three-dimensional integrated circuit technology (2024-11-19),
8. 12080763 - Silicide for group III-nitride devices and methods of fabrication (2024-09-03),
9. 12027613 - III-N transistor arrangements for reducing nonlinearity of off-state capacitance (2024-07-02),
10. 11948831 - Apparatus with multi-wafer based device and method for forming such (2024-04-02),
11. 11881511 - Superlattice FINFET with tunable drive current capability (2024-01-23),
12. 11854894 - Integrated circuit device structures and double-sided electrical testing (2023-12-26),
13. 11791221 - Integration of III-N transistors and semiconductor layer transfer (2023-10-17),
14. 11757027 - E-D mode 2DEG FET with gate spacer to locally tune VT and improve breakdown (2023-09-12),
15. 11721649 - Microelectronic assemblies (2023-08-08),

Title: Innovations by Paul B. Fischer: A Leader in Microelectronic Assemblies

Introduction: Paul B. Fischer, an accomplished inventor based in Portland, OR, has made significant contributions to the field of microelectronics through his innovative patents. With an impressive portfolio of 108 patents, he is recognized for developing groundbreaking technologies that advance electronic assembly and integration.

Latest Patents: Among his latest patents, Fischer has focused on the development of microelectronic assemblies and methods. One notable patent describes a microelectronic assembly that includes two dies, where the first die is smaller and contained within the footprint of the second die. This design enhances the interconnection between the two components, showcasing Fischer's expertise in creating efficient microelectronic solutions. Another recent patent involves the integration of silicon-based transistors with non-silicon technologies through semiconductor regrowth over an insulator material. This innovation facilitates the development of integrated circuits (IC) that can effectively utilize both silicon and non-silicon devices.

Career Highlights: Paul B. Fischer is currently a key member of Intel Corporation, one of the world's leading technology companies. His role involves driving research and development in microelectronic assemblies and contributing to advancing semiconductor technologies. Throughout his career, Fischer has established himself as a leader in innovation, pushing the boundaries of what is possible in microelectronics.

Collaborations: Fischer has collaborated with notable colleagues, including Han Wui Then and Marko Radosavljevic. These partnerships have allowed him to explore new avenues in technology and enhance the development of cutting-edge innovations.

Conclusion: Paul B. Fischer's dedication to innovation and excellence in the field of microelectronics has led to numerous patents that have the potential to transform the industry. With his current work at Intel Corporation, Fischer continues to make significant strides in advancing microelectronic assemblies and integration technologies, thereby shaping the future of electronics and semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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