The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Sep. 07, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

John Heck, Berkeley, CA (US);

Paul B. Fischer, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01S 5/02 (2006.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H01S 5/026 (2013.01); H01S 5/021 (2013.01); H01S 5/0215 (2013.01); G02B 6/12004 (2013.01);
Abstract

Described herein are IC devices that include hybrid lasers formed with a bonding layer. Hybrid lasers include an active light-emitting region coupled to a waveguide. In a hybrid laser, the waveguide and the light-emitting regions are formed separately from different materials, e.g., the waveguide is a single-crystal silicon, and the light-emitting region includes III-V semiconductors. An amorphous group IV material, such as silicon or germanium, is advantageously used to bond the light-emitting region to the waveguide.


Find Patent Forward Citations

Heck, John. (2026). Hybrid laser with amorphous bonding layer (U.S. Patent No. 12548973). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12548973

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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