The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Apr. 25, 2022
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Chandler, AZ (US);
Henning Braunisch, Phoenix, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Patrick Morrow, Portland, OR (US);
Kimin Jun, Portland, OR (US);
Brennen Mueller, Portland, OR (US);
Paul B. Fischer, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include: a first die having a first surface and an opposing second surface, first conductive contacts at the first surface of the first die, and second conductive contacts at the second surface of the first die; and a second die having a first surface and an opposing second surface, and first conductive contacts at the first surface of the second die; wherein the second conductive contacts of the first die are coupled to the first conductive contacts of the second die by interconnects, the second surface of the first die is between the first surface of the first die and the first surface of the second die, and a footprint of the first die is smaller than and contained within a footprint of the second die.